Slurry supplying apparatus
Continuous slurry dispenser Temperature and fluid control / Slurry supplying apparatus
- Product Summary
- We have diluted the stock solution and supplied the temperature controlled slurry to the polishing machine continuously and realized space saving, energy saving and low cost by our proprietary transfer, dilution and temperature control system.
- Use
- Back grinder, CMP, polish grinder, grinding equipment
specification
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slurry
Colloidal silica-based pH11
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Dilution factor
10, 15, 20 times
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pH control
pH10～11±0.2
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Temperature control
20～40±0.5℃
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The supply flow rate
1.5L/min ､0.3MPa
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Slurry tank
20L built-in
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Ammonia tank
5L built
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External dimensions
W1250*D580*H1400
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weight
500kg
Simple slurry dispenser
Temperature and fluid control / Slurry supplying apparatus
- Product Summary
- An experimental feeder for supplying diluted and mixed slurry solution in a tank to a device
- Use
- Wafer polishing
specification
-
Model
P65
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tank capacity
125L Ivory PVC
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Diaphragm pump
10L/min
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Supply air
85L/min
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Power capacity
AC100V 5A
Slurry supplying apparatus for CMP P108
Temperature and fluid control / Slurry supplying apparatus
- Product Summary
- This apparatus dilutes the slurry stock solution and supplies slurry to the polishing machine.
- Use
- Semiconductor wafer CMP process.
specification
-
Model
P108
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Diluent flow rate
3～4L/min at 0.2MPa
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Supply pressure
0.2MPa max
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Supply tank capacity
27L
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Pump for transferring the original liquid
Teflon diaphragm pump
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Pump for delivering diluted liquied
Bellows pump and damper