Temperature and fluid control / Slurry supplying apparatus
P108
Overview
This apparatus dilutes the slurry stock solution and supplies slurry to the polishing machine.
Applications
Semiconductor wafer CMP process.
Specifications
| Model | P108 |
|---|---|
| Diluent flow rate | 3～4L/min at 0.2MPa |
| Supply pressure | 0.2MPa max |
| Supply tank capacity | 27L |
|---|---|
| Pump for transferring the original liquid | Teflon diaphragm pump |
| Pump for delivering diluted liquied | Bellows pump and damper |
Related products
Slurry Supplying Apparatus Product Lineup
Contact
Contact
Please feel free to contact us with any questions about equipment development and manufacturing, or requests for custom solutions.
042-659-3915
Weekdays 9:00–17:00 (Closed on weekends and holidays)
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