pump unit / high-pressure pump

SSBL series

  • SSBL-20
  • SSBL-30
  • SSBL-37.5

Overview

Available for explosion-proof areas because electricity is not used with air driven plunger pumps Ideal for incorporating lift-off devices, etc.

Applications

Used for IPA cleaning of wafers and detachment by solvent for high pressure jet cleaning

Specifications

Model SSBL series
Discharge pressure SSBL-20 : 0.98~9.8MPa
SSBL-30 : 1.47~14.7MPa
SSBL-37.5 : 1.76~17.6MPa
The discharge flow rate SSBL-20 : 1.13L/min
SSBL-30 : 0.71L/min
SSBL-37.5 : 0.58L/min
The discharge flow rate 0.05~0.5MPa
Air consumption About 70L (when the pump stroke number 60SPM)
Wetted seal Pure water, IPA · · · FKM
NMP · · · Kalrez

Description

The “SSBL Series” is a pump designed for use in lift-off equipment, which removes films from wafers and other substrates by high-pressure spraying of pure water, IPA, NMP, and other fluids.
Because it is air-driven, it can be used in locations requiring fire and explosion prevention measures.

Fluororesin and ultra-high-molecular-weight polyethylene are used as sealing materials in the pressure-boosting section.
O-rings are available in FKM or Calrets specifications.
We have been supplying these pumps to the market for 25 years, since 2000.

[Features]
■ Compact design ideal for integration
■ Discharge pressure can be controlled by adjusting the air supply pressure
■ Capable of boosting pressure up to 17.6 MPa with an air supply pressure of 0.5 MPa (SSBL-37.5A)

*For more details, please refer to the PDF brochure or feel free to contact us.

Related products

High Pressure Pump Product Lineup

Contact

Contact

Please feel free to contact us with any questions about equipment development and manufacturing, or requests for custom solutions.

042-659-3915

Weekdays 9:00–17:00 (Closed on weekends and holidays)

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